Invention Grant
- Patent Title: Silicon carbide semiconductor device and method for manufacturing same
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Application No.: US15504582Application Date: 2014-11-06
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Publication No.: US09935170B2Publication Date: 2018-04-03
- Inventor: Toshikazu Tanioka , Yoichiro Tarui , Masayuki Furuhashi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2014/079452 WO 20141106
- International Announcement: WO2016/071990 WO 20160512
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/167 ; H01L21/324 ; H01L21/04 ; H01L21/02 ; H01L29/66 ; H01L29/78

Abstract:
A silicon carbide semiconductor device can switch between an on-state and an off-state by controlling a channel region with an application of a gate voltage. The silicon carbide semiconductor device includes a silicon carbide layer, a gate insulating film, and a gate electrode. The silicon carbide layer includes a channel region. The gate insulating film covers the channel region. The gate electrode faces the channel region with the gate insulating film therebetween. The resistance of the channel region in the on-state takes a minimum value at a temperature of not less than 100° C. and not more than 150° C.
Public/Granted literature
- US20170250254A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-08-31
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