Invention Grant
- Patent Title: Wafer for solar cell, method of producing wafer for solar cell, method of producing solar cell, and method of producing solar cell module
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Application No.: US14878925Application Date: 2015-10-08
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Publication No.: US09935216B2Publication Date: 2018-04-03
- Inventor: Shigeru Okuuchi
- Applicant: SUMCO Corporation
- Applicant Address: JP Minato-ku
- Assignee: SUMCO Corporation
- Current Assignee: SUMCO Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Priority: JP2011-212335 20110928
- Main IPC: H01L31/0236
- IPC: H01L31/0236 ; H01L31/18 ; H01L31/0368

Abstract:
Provided is a wafer for solar cell which can be produced using a polycrystalline semiconductor wafer cut out using a bonded abrasive wire, which wafer can be used for manufacturing a solar cell with high conversion efficiency.In a wafer for solar cell before acid texturing of the present invention, produced from a polycrystalline semiconductor wafer cut out using a bonded abrasive wire, an amorphous layer does not exist, and irregularities caused due to the cutting using the bonded abrasive wire are left in at least one surface of the wafer for solar cell.
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