Invention Grant
- Patent Title: Low profile packaging and assembly of a power conversion system in modular form
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Application No.: US14163852Application Date: 2014-01-24
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Publication No.: US09936579B2Publication Date: 2018-04-03
- Inventor: Sunil M. Akre , Shawn X. Arnold
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01F27/29 ; H01F27/02 ; H01F27/24 ; H05K1/14 ; H05K1/16 ; H05K1/18

Abstract:
Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module includes an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, and input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component are thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.
Public/Granted literature
- US20140218155A1 LOW PROFILE PACKAGING AND ASSEMBLY OF A POWER CONVERSION SYSTEM IN MODULAR FORM Public/Granted day:2014-08-07
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