Invention Grant
- Patent Title: Hot melt adhesive
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Application No.: US15382776Application Date: 2016-12-19
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Publication No.: US09937277B2Publication Date: 2018-04-10
- Inventor: William L. Bunnelle
- Applicant: The Procter & Gamble Company
- Applicant Address: US OH Cincinnati
- Assignee: The Procter & Gamble Company
- Current Assignee: The Procter & Gamble Company
- Current Assignee Address: US OH Cincinnati
- Agent James T. Fondriest; Kathleen Y. Carter
- Main IPC: C08L53/00
- IPC: C08L53/00 ; A61L15/58 ; A61L15/60 ; A61F13/539 ; A61F13/15 ; A61F13/53
Abstract:
A hot melt adhesive material and articles made using the hot melt adhesive to assemble structures in an article. The adhesive material typically is manufactured by blending amorphous polymer with a heterophase polymer having crystallinity into an adhesive composition.
Public/Granted literature
- US20170095587A1 HOT MELT ADHESIVE Public/Granted day:2017-04-06
Information query
