Disclosed is a panel polishing device, comprising a polishing belt movable along a predefined direction and a spray head arranged above the belt. The spray head has a main body and a plurality of through-holes penetrating the main body in its thickness direction. Through-holes have outlets facing the belt and are arranged along a length direction of the spray head. The length direction of the spray head conforms to a movement direction of the belt. At least the through-holes on both sides of the main body are oblique outwardly with respect to the remaining through-holes. Also, the disclosure provides a panel cleaning equipment including the panel polishing device. In the device according to the disclosure, pressure of bi-component fluid is more widely applied onto belt and a larger belt is contacted with the panel, such that the panel is thoroughly cleaned without polishing blind regions on both sides thereof.