Invention Grant
- Patent Title: Shuttle system to move strapped/bundled material for sawing
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Application No.: US15344470Application Date: 2016-11-04
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Publication No.: US09937571B2Publication Date: 2018-04-10
- Inventor: Walter Di Giovanni , Wieslaw Raczynski , Zbigniew E. Pasiak , Robin Van Schaayk
- Applicant: HYD-MECH GROUP LIMITED
- Applicant Address: CA Woodstock, Ontario
- Assignee: Hyd-Mech Group Limited
- Current Assignee: Hyd-Mech Group Limited
- Current Assignee Address: CA Woodstock, Ontario
- Agency: Womble Bond Dickinson US LLP
- Main IPC: B23D55/04
- IPC: B23D55/04

Abstract:
There is provided in a preferred embodiment an apparatus for feeding an elongated material in a direction substantially generally along a length thereof to a cutting device having a cutting surface. The apparatus includes a lifting base assembly and a material shuttling assembly secured on the pivoting base assembly, the latter defining a feeding path. The lifting base assembly has a lower base portion and an upper base portion hingedly coupled to the lower base portion along a base pivoting axis generally parallel to and laterally offset from the feeding path. The upper base portion is selectively rotatable about the pivoting axis relative to the lower base portion between a level position and a lifted position, wherein in the lifted position, the material is raised above the cutting surface in an angled orientation where the material is further raised along a first lateral end portion relative to a second lateral end portion opposed to the first lateral end portion, the second lateral end portion being proximal to the pivoting axis.
Public/Granted literature
- US20170129027A1 SHUTTLE SYSTEM TO MOVE STRAPPED/BUNDLED MATERIAL FOR SAWING Public/Granted day:2017-05-11
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