Invention Grant
- Patent Title: Shape memory thermal interface materials
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Application No.: US15254039Application Date: 2016-09-01
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Publication No.: US09937662B2Publication Date: 2018-04-10
- Inventor: Joseph Kuczynski , Kevin M. O'Connell , Chelsie M. Peterson , Mark D. Plucinski , Timothy J. Tofil
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jared L. Montanaro
- Main IPC: B32B41/00
- IPC: B32B41/00 ; B29C65/56 ; B29C35/08 ; B29C35/16 ; B29C47/00 ; B29C71/00 ; B29C65/48 ; H01L23/367 ; H01L21/48 ; B29K105/16 ; B29K105/00 ; B29L31/18 ; B29L31/34 ; H01L23/40
Abstract:
A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.
Public/Granted literature
- US20180056598A1 SHAPE MEMORY THERMAL INTERFACE MATERIALS Public/Granted day:2018-03-01
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