Invention Grant
- Patent Title: Modular ultrasonic device for use in package sealing systems
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Application No.: US15343407Application Date: 2016-11-04
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Publication No.: US09938032B2Publication Date: 2018-04-10
- Inventor: Mitch Matheny , Alexander B. Channell , Sean T. Flowers
- Applicant: EDISON WELDING INSTITUTE, INC.
- Applicant Address: US OH Columbus
- Assignee: Edison Welding Institute, Inc.
- Current Assignee: Edison Welding Institute, Inc.
- Current Assignee Address: US OH Columbus
- Agency: Frost Brown Todd LLC
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B65B51/22 ; B65B9/20 ; B65B51/30

Abstract:
An ultrasonic module for use in package sealing systems that includes a moveable front jaw; an elognated sonotrode disposed within the front jaw, wherein the sonotrode includes an elongated sealing face, and wherein the width of the sealing face is at least 12 inches (30.48 cm); a moveable rear jaw; and an anvil mounted on the rear jaw opposite the sonotrode, wherein the anvil mechanically cooperates with the sonotrode to seal a package.
Public/Granted literature
- US20170297754A1 MODULAR ULTRASONIC DEVICE FOR USE IN PACKAGE SEALING SYSTEMS Public/Granted day:2017-10-19
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