Invention Grant
- Patent Title: Gas supply mechanism, gas supplying method, film forming apparatus and film forming method using the same
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Application No.: US14669795Application Date: 2015-03-26
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Publication No.: US09938620B2Publication Date: 2018-04-10
- Inventor: Masayuki Moroi , Hajime Yamanaka , Yasushi Aiba , Takanobu Hotta
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014069964 20140328
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/448 ; C23C16/52 ; C23C16/08

Abstract:
A gas supply mechanism of supplying a raw material gas obtained from a raw material of a solid state or a liquid state into a chamber configured to perform a film forming process on a workpiece is disclosed. The gas supply mechanism includes a gas supply controller configured to control a flow rate of a carrier gas by means of a flow rate controller, and to enable the carrier gas to flow while closing a material gas supply/shut-off valve to thereby increase internal pressures of a raw material container and a raw material gas supply pipe to be a high-pressure condition and then control the raw material gas supply/shut-off valve to be opened.
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Information query
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