Invention Grant
- Patent Title: Method for enhancing bond strength through in-situ peening
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Application No.: US15025427Application Date: 2014-10-17
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Publication No.: US09938624B2Publication Date: 2018-04-10
- Inventor: Aaron T. Nardi , Tahany Ibrahim El-Wardany , William Werkheiser , Michael A. Klecka
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P.A.
- International Application: PCT/US2014/061114 WO 20141017
- International Announcement: WO2015/061164 WO 20150430
- Main IPC: C23C24/04
- IPC: C23C24/04 ; B32B15/01 ; B24C1/10
Abstract:
One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the substrate without shot peening.
Public/Granted literature
- US20160237573A1 METHOD FOR ENHANCING BOND STRENGTH THROUGH IN-SITU PEENING Public/Granted day:2016-08-18
Information query
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