- Patent Title: Substrate transfer system and heat treatment apparatus using same
-
Application No.: US14948673Application Date: 2015-11-23
-
Publication No.: US09939200B2Publication Date: 2018-04-10
- Inventor: Koyu Hasegawa , Kyoko Ikeda
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-237377 20141125
- Main IPC: F27D3/00
- IPC: F27D3/00 ; H01L21/47

Abstract:
A substrate transfer system includes a substrate transfer part capable of transferring a substrate while holding the substrate, an elevating mechanism including a support axis extending in an upper-lower direction and being capable of moving the substrate transfer part along the support axis within a predetermined range, a first exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis above an upper limit of the predetermined range, a second exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis below a lower limit of the predetermined range, and an exhaust part connected such that exhaust is available through the first exhaust port and the second exhaust port.
Public/Granted literature
- US20160146539A1 Substrate Transfer System and Heat Treatment Apparatus Using Same Public/Granted day:2016-05-26
Information query