Invention Grant
- Patent Title: Heat spreading module
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Application No.: US15165518Application Date: 2016-05-26
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Publication No.: US09939204B2Publication Date: 2018-04-10
- Inventor: Thanhlong Phan , Youji Kawahara , Yuichi Yokoyama , Yuji Saito , Mohammad Shahed Ahamed , Koichi Mashiko
- Applicant: Fujikura Ltd.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; F28D15/04 ; F28F3/08 ; F28F21/08 ; F28D21/00

Abstract:
In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.
Public/Granted literature
- US20170343294A1 HEAT SPREADING MODULE Public/Granted day:2017-11-30
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