Invention Grant
- Patent Title: Electronic device, manufacturing method thereof, and electronic apparatus
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Application No.: US14692177Application Date: 2015-04-21
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Publication No.: US09939266B2Publication Date: 2018-04-10
- Inventor: Teruo Takizawa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-207262 20110922; JP2011-244467 20111108; JP2011-244468 20111108
- Main IPC: G01C19/5712
- IPC: G01C19/5712 ; G01C25/00 ; B81B7/00

Abstract:
An electronic device includes a base body, a functional element that is placed on the base body, and a lid body, formed from silicon, that is placed over the base body so as to cover the functional element. A hole portion and a sealing member that closes the hole portion are disposed in the lid body, in the hole portion, the area of a second opening disposed on a side opposite to a first opening is larger than the area of the first opening disposed on the base body side, and the ratio of the volume of the sealing member to the volume of the hole portion is equal to or higher than 35% and is equal to or lower than 87%.
Public/Granted literature
- US20150345947A1 ELECTRONIC DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS Public/Granted day:2015-12-03
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