Invention Grant
- Patent Title: Systems and methods for minimum-implant-area aware detailed placement
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Application No.: US15164612Application Date: 2016-05-25
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Publication No.: US09940424B2Publication Date: 2018-04-10
- Inventor: Yao-Wen Chang , Kai-Han Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F15/78

Abstract:
The present disclosure is directed to systems and methods for a minimum-implant-area (MIA) aware detailed placement. In embodiments, the present disclosure clusters a violation cell with the cells having a same threshold voltage (Vt) and determines an optimal region for a cluster to minimize the wire-length. In further embodiments, an MIA-aware cell flipping technique minimizes a design area while satisfying the MIA constraint.
Public/Granted literature
- US20170344686A1 SYSTEMS AND METHODS FOR MINIMUM-IMPLANT-AREA AWARE DETAILED PLACEMENT Public/Granted day:2017-11-30
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