Invention Grant
- Patent Title: Surface treatment in a chemical mechanical process
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Application No.: US15197439Application Date: 2016-06-29
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Publication No.: US09941109B2Publication Date: 2018-04-10
- Inventor: Chih-Wen Liu , Che-Hao Tu , Po-Chin Nien , William Weilun Hong , Ying-Tsung Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/306 ; H01L21/67 ; H01L21/683 ; B24B37/04 ; H01L21/321 ; B24B1/00
Abstract:
A method is presented that includes the step of polishing a wafer positioned on a platen. After polishing the wafer, the method includes initiating a high pressure rinse on the wafer while the wafer is positioned on the platen, wherein the high pressure rinse includes a hydrophilic solution. The wafer is soaked in the hydrophilic solution, and after soaking the wafer, the wafer is cleaned.
Public/Granted literature
- US20180005840A1 Surface Treatment in a Chemical Mechanical Process Public/Granted day:2018-01-04
Information query
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