Invention Grant
- Patent Title: Guard ring structure of semiconductor arrangement
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Application No.: US15463213Application Date: 2017-03-20
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Publication No.: US09941141B2Publication Date: 2018-04-10
- Inventor: Sheng-Fang Cheng , Chen-Chih Wu , Chien-Yuan Lee , Yen-Lin Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/3205 ; H01L21/768 ; H01L21/265
Abstract:
Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring.
Public/Granted literature
- US20170194165A1 GUARD RING STRUCTURE OF SEMICONDUCTOR ARRANGEMENT Public/Granted day:2017-07-06
Information query
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