- Patent Title: Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate
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Application No.: US15322171Application Date: 2015-06-15
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Publication No.: US09941197B2Publication Date: 2018-04-10
- Inventor: Eckhard Ditzel , Siegfried Walter , Michael Benedikt , Udo Becker
- Applicant: Heraeus Deutschland GmbH & Co. KG
- Applicant Address: DE Hanau
- Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
- Current Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
- Current Assignee Address: DE Hanau
- Agency: Katten Muchin Rosenman LLP
- Agent Hassan Abbas Shakir
- Priority: DE102014108916 20140625
- International Application: PCT/EP2015/063257 WO 20150615
- International Announcement: WO2015/197386 WO 20151230
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/66 ; G06K19/07 ; G06K19/077 ; H01L23/00 ; H01L23/31
Abstract:
A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.
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