Invention Grant
- Patent Title: Warpage control in package-on-package structures
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Application No.: US15370653Application Date: 2016-12-06
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Publication No.: US09941221B2Publication Date: 2018-04-10
- Inventor: Wei-Yu Chen , Yu-Hsiang Hu , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/36 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L23/373 ; H01L23/498 ; H01L25/10 ; H01L25/00 ; H01L23/31
Abstract:
A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.
Public/Granted literature
- US20170084549A1 Warpage Control in Package-on-Package Structures Public/Granted day:2017-03-23
Information query
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