A semiconductor device 10 includes: multi-layered substrates 12 each having a circuit board 12c; control terminals 14 whose one end is fixed on the circuit board 12c of each multi-layered substrate 12; a resin case 15 which has openings 20 and is arranged to cover the multi-layered substrates 12, through which openings 20 the other ends of the control terminals 14 extend outwardly; and resin blocks 18 which are each inserted into the openings 20 of the resin case 15 and press-fixes the control terminals 14 against the side walls of the respective openings 20. The control terminals 14 each have a low-rigidity portion 14j at a position that is further interior of the resin case 15 than a position where each control terminal 14 is in contact with the resin block 18 in the respective openings 20 of the resin case 15.