Invention Grant
- Patent Title: Manufacturing method for LTPS TFT substrate
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Application No.: US14908555Application Date: 2015-12-30
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Publication No.: US09941312B2Publication Date: 2018-04-10
- Inventor: Songshan Li
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Leong C. Lei
- Priority: CN201510885433 20151203
- International Application: PCT/CN2015/099985 WO 20151230
- International Announcement: WO2017/092142 WO 20170608
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/06 ; H01L29/786 ; H01L29/66 ; H01L29/45 ; H01L21/266 ; H01L29/423 ; H01L21/02 ; H01L21/265 ; H01L21/30 ; H01L29/49

Abstract:
The invention provides a manufacturing method for LTPS TFT substrate. After forming N+ areas on both sides of polysilicon layer, the first gate insulating layer, first gate, second gate insulating layer, and second gate are sequentially formed on polysilicon layer, and the second gate is wider than first gate to produce a low electric field region in the polysilicon layer to reduce leakage current; alternatively, forming first gate and first gate insulating layer, forming polysilicon layer and N+ areas on both sides of polysilicon layer, forming second gate insulating layer and second gate on polysilicon layer, the second gate insulating layer is thicker than first gate insulating layer and the second gate is wider than first gate, so that the second gate insulating layer sandwiched by the second gate beyond first gate and polysilicon layer is thicker and produces a smaller electric field, which simplifies process and reduce cost.
Public/Granted literature
- US20180033808A1 MANUFACTURING METHOD FOR LTPS TFT SUBSTRATE Public/Granted day:2018-02-01
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