Invention Grant
- Patent Title: Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate
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Application No.: US14989508Application Date: 2016-01-06
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Publication No.: US09941326B2Publication Date: 2018-04-10
- Inventor: Nobutoshi Fujii , Kenichi Aoyagi , Yoshiya Hagimoto , Hayato Iwamoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2012-007086 20120117; JP2012-007087 20120117; JP2012-007088 20120117
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146 ; H01L25/00 ; H01L31/18 ; H01L25/065
Abstract:
The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition to each other; forming a protective film on at least an edge of the second substrate having the second device; and reducing a thickness of the first substrate.
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