Invention Grant
- Patent Title: Semiconductor device comprising a first gate trench and a second gate trench
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Application No.: US15374254Application Date: 2016-12-09
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Publication No.: US09941354B2Publication Date: 2018-04-10
- Inventor: Britta Wutte , Sylvain Leomant
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015121497 20151210
- Main IPC: H01L29/74
- IPC: H01L29/74 ; H01L27/148 ; H01L29/80 ; H01L27/108 ; H01L21/336 ; H01L21/331 ; H01L29/06 ; H01L29/40 ; H01L29/78 ; H02M3/158 ; H01L29/423 ; H01L29/417

Abstract:
A semiconductor device includes a first gate trench and a second gate trench in a first main surface of a semiconductor substrate. A mesa is arranged between the first gate trench and the second gate trench. The mesa separates the first gate trench from the second gate trench. Each of the first and second gate trenches includes first sections extending in a first direction and second sections connecting adjacent ones of the first sections. The second sections of the first gate trench are disposed opposite to the second sections of the second gate trench with respect to a plane perpendicular to the first direction.
Public/Granted literature
- US20170170274A1 Semiconductor Device Comprising a First Gate Trench and a Second Gate Trench Public/Granted day:2017-06-15
Information query
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