Invention Grant
- Patent Title: Method for forming a stress-reduced field-effect semiconductor device
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Application No.: US15189152Application Date: 2016-06-22
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Publication No.: US09941365B2Publication Date: 2018-04-10
- Inventor: Stefan Sedlmaier , Markus Zundel , Franz Hirler , Johannes Baumgartl , Anton Mauder , Ralf Siemieniec , Oliver Blank , Michael Hutzler
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L21/765 ; H01L29/51 ; H01L29/66 ; H01L29/06 ; H01L29/739 ; H01L29/417 ; H01L29/423

Abstract:
A method for producing a field-effect semiconductor device includes providing a semiconductor body with a first surface defining a vertical direction, defining an active area, forming a vertical trench from the first surface into the semiconductor body, forming a field dielectric layer at least on a side wall and a bottom wall of the vertical trench, depositing a conductive layer on the field dielectric layer, forming a closed cavity on the conductive layer in the vertical trench, and forming an insulated gate electrode on the closed cavity in the vertical trench.
Public/Granted literature
- US20160300914A1 Method for Forming a Stress-Reduced Field-Effect Semiconductor Device Public/Granted day:2016-10-13
Information query
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