Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15250972Application Date: 2016-08-30
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Publication No.: US09941397B2Publication Date: 2018-04-10
- Inventor: Takeshi Fujii , Seiji Momota
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2014-188682 20140917
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L29/06

Abstract:
In a trench deeper than a thickness of a p-type base layer and configured by a first trench and a second trench, a second trench positioned at a lower portion is configured by a third trench and a fourth trench. A width of the second trench along an X direction is expanded more than the first trench positioned above the second trench. Along the X direction, the extent to which the second trench is expanded differs for the third trench and the fourth trench. Thus, a width of the lower portion of the trench differs along a Y direction, enabling reduced gate capacitance compared to uniform expansion along a transverse direction of the trench. Further, ON voltage may be reduced and switching capability may be improved.
Public/Granted literature
- US20160372586A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-12-22
Information query
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