Invention Grant
- Patent Title: Method for manufacturing a thin film transistor substrate
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Application No.: US15372671Application Date: 2016-12-08
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Publication No.: US09941409B2Publication Date: 2018-04-10
- Inventor: Takaharu Konomi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2014-229474 20141112
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H01L27/12 ; G02F1/1368 ; G02F1/1362

Abstract:
A thin film transistor substrate includes a semiconductor channel layer made of an oxide semiconductor, protective insulating layers that cover the semiconductor channel layer, a first source electrode, a first drain electrode, a second source electrode, and a second drain electrode. The second source electrode is located on the first source electrode and connected with the semiconductor channel layer through a first contact hole. The second drain electrode is located on the first drain electrode and connected with the semiconductor channel layer through a second contact hole.
Public/Granted literature
- US20170092775A1 THIN FILM TRANSISTOR SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND LIQUID CRYSTAL DISPLAY Public/Granted day:2017-03-30
Information query
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