Invention Grant
- Patent Title: Method of producing heat conductive sheet
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Application No.: US14402195Application Date: 2013-07-08
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Publication No.: US09944840B2Publication Date: 2018-04-17
- Inventor: Keisuke Aramaki
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-153146 20120707
- International Application: PCT/JP2013/068667 WO 20130708
- International Announcement: WO2014/010563 WO 20140116
- Main IPC: B29C47/00
- IPC: B29C47/00 ; C09K5/14 ; C08J5/18 ; H05K7/20 ; H01L23/373 ; H01L21/48 ; B29D7/01 ; F28F21/02 ; B29C43/02 ; B29C47/08 ; B29K83/00 ; B29K505/00 ; B29K507/04 ; B29K509/02 ; B29K509/08

Abstract:
A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.
Public/Granted literature
- US20150144316A1 METHOD OF PRODUCING HEAT CONDUCTIVE SHEET Public/Granted day:2015-05-28
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