Invention Grant
- Patent Title: Thermal-type air flow meter
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Application No.: US14907118Application Date: 2014-02-03
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Publication No.: US09945706B2Publication Date: 2018-04-17
- Inventor: Masatoshi Ogata , Norio Ishitsuka , Shinobu Tashiro , Noboru Tokuyasu , Takeshi Morino
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka-Shi
- Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee Address: JP Hitachinaka-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-153119 20130724
- International Application: PCT/JP2014/052383 WO 20140203
- International Announcement: WO2015/011936 WO 20150129
- Main IPC: G01F1/68
- IPC: G01F1/68 ; G01F1/684 ; G01F1/692 ; G01F5/00 ; G01F15/14

Abstract:
An object of the present invention is to provide a thermal-type air flow meter with a high measurement accuracy by reducing influence of a thermal stress generated in a resistor in an LSI while securing a high positioning accuracy flow rate detection unit. Thus, a thermal-type air flow meter is provided with: a sensor assembly 100 including an LSI 3 having a resistor 7 and a flow rate detection unit 4a which are configured by insert molding so as to expose at least a part of the flow rate detection unit 4a, a housing 301 which has secondary passages 305i, 305o and 305s, and houses the sensor assembly 100 by allowing the flow rate detection unit 4a to be arranged in the secondary passage 305s, the sensor assembly 100 being molded using a first resin, and the housing 301 being molded using a second resin, the sensor assembly 100 being fixed to the housing 301 using the second resin; and resin structures 20 and 21 which cause a tensile stress in a direction parallel to a surface on which the flow rate detection unit 4a is exposed with respect to the sensor assembly 100.
Public/Granted literature
- US20160161312A1 THERMAL-TYPE AIR FLOW METER Public/Granted day:2016-06-09
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