Invention Grant
- Patent Title: Surface mounted electronic component
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Application No.: US14956302Application Date: 2015-12-01
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Publication No.: US09947459B2Publication Date: 2018-04-17
- Inventor: Heung Kil Park , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0012642 20150127
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01F27/29 ; H01G4/30 ; H01G4/40 ; H01F17/00 ; H01G4/38 ; H01G2/06 ; H01G4/228 ; H01G4/248 ; H05K1/02 ; H05K7/02 ; H01G4/12

Abstract:
A surface mounted electronic component includes a first frame terminal including a first end surface frame extending in a first direction and first upper and lower surface frames extending from upper and lower ends of the first end surface frame in a second direction; a second frame terminal including a second end surface frame opposing the first end surface frame and extending in the first direction and second upper and lower surface frames extending from upper and lower ends of the second end surface frame in a third direction opposite to the second direction; a first electronic component disposed between the first and second end surface frames below the first and second upper surface frames; and a second electronic component disposed on the first and second upper surface frames.
Public/Granted literature
- US20160219739A1 SURFACE MOUNTED ELECTRONIC COMPONENT Public/Granted day:2016-07-28
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