A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open. The base vacuum pump and the reservoir vacuum pump are each operative to reduce a pressure of the cavity pressure zone to the molding process pressure when they are in fluid communication with the cavity pressure zone.