Invention Grant
- Patent Title: Semiconductor package
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Application No.: US15268658Application Date: 2016-09-19
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Publication No.: US09947644B2Publication Date: 2018-04-17
- Inventor: Jinhee Hong , Wansoo Park , Chul Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0179362 20151215
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/18 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor package is provided. The semiconductor package may include a plurality of memory chips, which are mounted on a top surface of a package substrate, and a plurality of controller chips, which are vertically stacked on at least one of top and bottom surfaces of the package substrate.
Public/Granted literature
- US20170170156A1 SEMICONDUCTOR PACKAGE Public/Granted day:2017-06-15
Information query
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