Invention Grant
- Patent Title: Electronic device mounting substrate and electronic apparatus
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Application No.: US15321417Application Date: 2015-03-26
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Publication No.: US09947836B2Publication Date: 2018-04-17
- Inventor: Mitsuharu Sakai , Shou Yamasaki , Shigetoshi Inuyama , Noritaka Niino
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-191173 20140919
- International Application: PCT/JP2015/059477 WO 20150326
- International Announcement: WO2016/042819 WO 20160324
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/48 ; H01L23/053 ; H01L27/146 ; H01L31/0203 ; H01L23/498 ; H01L31/0232 ; H01L33/58 ; H01L31/02 ; H01L33/62

Abstract:
An electronic device mounting substrate includes: a first wiring substrate shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole; a second wiring substrate shaped in a rectangular frame or plate, the second wiring substrate being disposed so as to overlie a lower surface of the first wiring substrate and be electrically connected to the first wiring substrate; a metallic plate disposed so as to overlie a lower surface of the second wiring substrate so that the second wiring substrate is sandwiched between the metallic plate and the first wiring substrate; and a lens holder secured to an outer periphery of the metallic plate. A frame interior of the first wiring substrate, or a frame interior of each of the first wiring substrate and the second wiring substrate, constitutes an electronic device mounting space.
Public/Granted literature
- US20170213940A1 ELECTRONIC DEVICE MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS Public/Granted day:2017-07-27
Information query
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