Invention Grant
- Patent Title: LED assembly
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Application No.: US15297554Application Date: 2016-10-19
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Publication No.: US09947839B2Publication Date: 2018-04-17
- Inventor: Tzer-Perng Chen , Tzu-Chi Cheng
- Applicant: HUGA OPTOTECH INC. , Interlight Optotech Corporation
- Applicant Address: TW Taichung TW Yangmei, Taoyuan County
- Assignee: Huga Optotech Inc.,Interlight Optotech Corporation
- Current Assignee: Huga Optotech Inc.,Interlight Optotech Corporation
- Current Assignee Address: TW Taichung TW Yangmei, Taoyuan County
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW102136176A 20131007
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/50 ; H01L33/48

Abstract:
This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
Public/Granted literature
- US20170040504A1 LED ASSEMBLY Public/Granted day:2017-02-09
Information query
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