The present invention provides a LED package in which deterioration in heat radiation performance is suppressed. The LED package comprises a substrate, a light-emitting device mounted on the substrate, sealing resin sealing the light-emitting device and mixed with phosphor, a heat sink provided on a rear surface of the substrate, and a rear electrode provided on the rear surface of the substrate and electrically connected to the light-emitting device. The heat sink is provided at a distance from the rear electrode in a region except for the rear electrode. The heat sink is divided into eighteen small heat sinks by grooves formed in a rectangular lattice pattern. When the LED package is mounted on a mounting substrate, the gas generated from solder is efficiently discharged through the grooves to the outside, thereby suppressing the generation of air bubbles between the heat sink and the solder.