Invention Grant
- Patent Title: High-frequency module
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Application No.: US15396863Application Date: 2017-01-03
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Publication No.: US09948269B2Publication Date: 2018-04-17
- Inventor: Hiromichi Kitajima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2014-145200 20140715
- Main IPC: H03H7/46
- IPC: H03H7/46 ; H03H7/38 ; H05K1/02 ; H05K1/18 ; H04B1/00 ; H03H9/72 ; H04B1/50 ; H04B15/00

Abstract:
A high-frequency module includes a wiring board, a first duplexer that separates a transmission signal and a reception signal in a first frequency band, and a second duplexer that separates a transmission signal and a reception signal in a second frequency band whose reception-side frequency band partially overlaps with a frequency band of a third-order harmonic of the first transmission signal. The first duplexer is disposed near a predetermined side on a first main surface of the wiring board, and the second duplexer is disposed near an opposite side opposing the predetermined side. An extended line extending from a first transmission terminal of the first duplexer and an extended line extending from a second reception terminal of the second duplexer are spaced away from each other.
Public/Granted literature
- US20170149469A1 HIGH-FREQUENCY MODULE Public/Granted day:2017-05-25
Information query
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