Invention Grant
- Patent Title: Surface acoustic wave device
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Application No.: US14541180Application Date: 2014-11-14
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Publication No.: US09948274B2Publication Date: 2018-04-17
- Inventor: Keiichi Umeda , Ryo Nakagawa , Atsushi Tanaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-113171 20120517
- Main IPC: H01L41/047
- IPC: H01L41/047 ; H03H9/02 ; H01L41/16

Abstract:
A surface acoustic wave device includes a high acoustic velocity film in which a transversal wave propagates at a higher acoustic velocity than in a ScAlN film laminated on a substrate made of silicon or glass. The ScAlN film is laminated on the high acoustic velocity film, and IDT electrodes are laminated on the ScAlN film.
Public/Granted literature
- US20150069882A1 SURFACE ACOUSTIC WAVE DEVICE Public/Granted day:2015-03-12
Information query
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