An electrical connector and the buckle assembly thereof. The buckle assembly includes a stiffener for receiving a socket, a load plate for pressing the chip module, and a guide frame pivoted to the stiffener. A rear end of the load plate is pivoted to the stiffener. The guide frame has an opening for receiving the chip module, and two side arms located on two opposite sides of the opening and a rear arm connected to the two side arms. Each of the side arms is provided with a sliding rail for carrying a side plate of a clamping member. The side plate is slidable along the sliding rail. The clamping member is used for fixing the chip module. A protruding portion is formed by protruding upward from the sliding rail, making the protruding portion higher than the sliding rail.