- Patent Title: Method for producing void-free additively manufactured components
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Application No.: US14695200Application Date: 2015-04-24
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Publication No.: US09950467B2Publication Date: 2018-04-24
- Inventor: Sergey Mironets
- Applicant: United Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P.A.
- Main IPC: B29C65/02
- IPC: B29C65/02 ; B29C67/00 ; B33Y30/00 ; B33Y80/00 ; B29C64/141 ; B33Y10/00 ; B22F3/105
Abstract:
A method of additive manufacturing of a component includes cutting a plurality of sheets, each sheet corresponding to a respective cross-section of the component, tack welding the sheets to one another to form a stack, arranging the stack in a mold, and spark plasma sintering the tack-welded stack of sheets to reduce vacancies and dislocations between adjacent sheets of the stack.
Public/Granted literature
- US20150321417A1 METHOD FOR PRODUCING VOID-FREE ADDITIVELY MANUFACTURED COMPONENTS Public/Granted day:2015-11-12
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