Invention Grant
- Patent Title: Element substrate for liquid ejecting head and wafer
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Application No.: US15287379Application Date: 2016-10-06
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Publication No.: US09950525B2Publication Date: 2018-04-24
- Inventor: Ryoji Oohashi , Koichi Omata , Hideo Tamura , Takaaki Yamaguchi , Kousuke Kubo , Suguru Taniguchi , Yuji Tamaru , Toshio Negishi , Yohei Osuki
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc., IP Division
- Priority: JP2015-200916 20151009
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.
Public/Granted literature
- US20170100930A1 ELEMENT SUBSTRATE FOR LIQUID EJECTING HEAD AND WAFER Public/Granted day:2017-04-13
Information query
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