Invention Grant
- Patent Title: Power-module assembly with dummy module
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Application No.: US15065330Application Date: 2016-03-09
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Publication No.: US09950628B2Publication Date: 2018-04-24
- Inventor: Guangyin Lei , Michael W. Degner , Edward Chan-Jiun Jih
- Applicant: Ford Global Technologies, LLC
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Brooks Kushman P.C.
- Agent David B. Kelley
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; B60L11/02 ; B60L11/18 ; H02M7/00 ; H02M7/44 ; H05K7/20

Abstract:
A power-electronics system includes a plurality of power modules each having a power stage and defining a side pocket. The power stages are stacked in an array such that the side pockets are interleaved with the power stages. A dummy module defines a first coolant pocket and is disposed within the array such that the first coolant pocket cooperates with one of the side pockets to define a coolant chamber.
Public/Granted literature
- US20170259672A1 Power-Module Assembly with Dummy Module Public/Granted day:2017-09-14
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