Invention Grant
- Patent Title: Polyamide resin composition and molded article
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Application No.: US14882755Application Date: 2015-10-14
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Publication No.: US09951202B2Publication Date: 2018-04-24
- Inventor: Kazunori Terada , Teruaki Sakuma
- Applicant: ASAHI KASEI KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-211037 20141015
- Main IPC: C08K5/20
- IPC: C08K5/20 ; C08K5/098 ; C08K5/103 ; C08K3/16
Abstract:
A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one fatty acid compound (D) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts, wherein the fatty acid compound (D) has an acid value of 5 mgKOH/g or less.
Public/Granted literature
- US20160108208A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Public/Granted day:2016-04-21
Information query
