- Patent Title: Copper-containing conductive pastes and electrodes made therefrom
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Application No.: US15505682Application Date: 2014-08-28
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Publication No.: US09951231B2Publication Date: 2018-04-24
- Inventor: Minfang Mu
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- International Application: PCT/CN2014/085377 WO 20140828
- International Announcement: WO2016/029397 WO 20160303
- Main IPC: H01B1/16
- IPC: H01B1/16 ; H01B1/22 ; H01L31/14 ; C09D5/24 ; H01L31/0224 ; H01M4/04
Abstract:
Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder of coated Cu particles and glass frit dispersed in an organic medium.
Public/Granted literature
- US20170275477A1 COPPER-CONTAINING CONDUCTIVE PASTES AND ELECTRODES MADE THEREFROM Public/Granted day:2017-09-28
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