Invention Grant
- Patent Title: Plating method for printed layer
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Application No.: US15148191Application Date: 2016-05-06
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Publication No.: US09951424B2Publication Date: 2018-04-24
- Inventor: Joseph Huang
- Applicant: HOEY CO., LTD.
- Applicant Address: TW Taoyuan
- Assignee: HOEY CO., LTD.
- Current Assignee: HOEY CO., LTD.
- Current Assignee Address: TW Taoyuan
- Agency: Guice Patents PLLC
- Priority: TW104117885A 20150603; TW104124314A 20150728
- Main IPC: C23C18/16
- IPC: C23C18/16 ; C23C18/32 ; C23C18/18 ; C23C18/00 ; C23C18/31 ; C23C18/42 ; C23C18/38 ; C25D7/00 ; C23C18/54 ; C25D3/12
Abstract:
A plating method includes: providing a work piece which is metal or non-metal; forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece.
Public/Granted literature
- US20160355929A1 PLATING METHOD FOR PRINTED LAYER Public/Granted day:2016-12-08
Information query
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