Invention Grant
- Patent Title: Method for depositing layer
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Application No.: US14764766Application Date: 2013-05-20
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Publication No.: US09951426B2Publication Date: 2018-04-24
- Inventor: Makoto Saito , Noriyuki Hiramatsu , Akira Fukushima
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2013-030404 20130219
- International Application: PCT/JP2013/063896 WO 20130520
- International Announcement: WO2014/128983 WO 20140828
- Main IPC: C23C24/04
- IPC: C23C24/04 ; C23C4/137 ; C23C4/06

Abstract:
A method for depositing a layer includes repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (depositing the layer on the deposition target by a cold spray process while the deposition target is heated by a heater and heat treating the deposition target after the depositing.
Public/Granted literature
- US20150368807A1 METHOD FOR DEPOSITING LAYER Public/Granted day:2015-12-24
Information query
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