Invention Grant
- Patent Title: High efficiency thermal transfer plate
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Application No.: US14245704Application Date: 2014-04-04
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Publication No.: US09952004B2Publication Date: 2018-04-24
- Inventor: Lloyd Wright , Leo Chin
- Applicant: Solid State Cooling Systems, Inc.
- Applicant Address: US NY Wappingers Fall
- Assignee: Solid State Cooling Systems
- Current Assignee: Solid State Cooling Systems
- Current Assignee Address: US NY Wappingers Fall
- Agency: Rogers Towers PA
- Agent Joseph P. Kincart
- Main IPC: F28F3/02
- IPC: F28F3/02 ; F28F21/06 ; F28F3/12 ; F28F21/04
Abstract:
The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.
Public/Granted literature
- US20140305619A1 HIGH EFFICIENCY THERMAL TRANSFER PLATE Public/Granted day:2014-10-16
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