Invention Grant
- Patent Title: Test device and method using single probe to test multiple pads of chip
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Application No.: US15097291Application Date: 2016-04-13
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Publication No.: US09952277B2Publication Date: 2018-04-24
- Inventor: Hung-Wei Lai , Tsung-Jun Lee
- Applicant: SYNC-TECH SYSTEM CORP.
- Applicant Address: TW Hsinchu County
- Assignee: SYNC-TECH SYSTEM CORP.
- Current Assignee: SYNC-TECH SYSTEM CORP.
- Current Assignee Address: TW Hsinchu County
- Agent Winston Hsu
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/3185

Abstract:
A test device uses a single probe to test plurality of pads of at least one chip, and includes a test circuit, a plurality of short-circuit elements and a plurality of probes. The plurality of short-circuit elements is formed in scribe lines around the at least one chip, where each of the plurality of short-circuit elements connects the plurality of pads, and the plurality of pads includes one testing pad and at least one non-testing pad. The plurality of probes receives a plurality of test signals generated by the at least one chip from the testing pad via the plurality of short-circuit elements, so the test circuit generates a test result according to the plurality of test signals.
Public/Granted literature
- US20170074922A1 Test Device and Method Using Single Probe to Test Multiple Pads of Chip Public/Granted day:2017-03-16
Information query