Invention Grant
- Patent Title: Heat dissipation structure for external apparatus, electronic apparatus, and external apparatus
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Application No.: US15306135Application Date: 2015-07-21
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Publication No.: US09952637B2Publication Date: 2018-04-24
- Inventor: Shinichirou Yonemaru
- Applicant: NEC Platforms, Ltd.
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: NEC Platforms, Ltd.
- Current Assignee: NEC Platforms, Ltd.
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-219466 20141028
- International Application: PCT/JP2015/003642 WO 20150721
- International Announcement: WO2016/067492 WO 20160506
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
A heat dissipation structure for an external apparatus is a heat dissipation structure for an external apparatus in an electronic apparatus including a housing section configured to removably house an external apparatus. The heat dissipation structure for an external apparatus includes a heat dissipation portion, which is removably attached to the external apparatus and which has thermal conductivity for transferring heat generated by the external apparatus to the housing section.
Public/Granted literature
- US20170052574A1 HEAT DISSIPATION STRUCTURE FOR EXTERNAL APPARATUS, ELECTRONIC APPARATUS, AND EXTERNAL APPARATUS Public/Granted day:2017-02-23
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