Invention Grant
- Patent Title: Semiconductor device and semiconductor package
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Application No.: US15090212Application Date: 2016-04-04
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Publication No.: US09953921B2Publication Date: 2018-04-24
- Inventor: Hyun-Bae Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2015-0159707 20151113
- Main IPC: H03K3/00
- IPC: H03K3/00 ; H01L23/528 ; H01L23/522 ; H01L25/065

Abstract:
A semiconductor device may include a first metal line; a second metal line; a first insulating layer formed between the first metal line and the second metal line; a first driving unit coupled to the first metal line, the first driving unit being suitable for driving the first metal line in response to first data; and a second driving unit coupled to the second metal line, the second driving unit being suitable for driving the second metal line in response to second data obtained by inverting and delaying the first data.
Public/Granted literature
- US20170141025A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE Public/Granted day:2017-05-18
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