Invention Grant
- Patent Title: Packaging for high speed chip to chip communication
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Application No.: US15453334Application Date: 2017-03-08
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Publication No.: US09953935B2Publication Date: 2018-04-24
- Inventor: Shidong Li
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Jennifer Anda
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/00 ; H01L23/367 ; H01L23/498 ; H01L21/48
Abstract:
Disclosed are chip packaging structures for high speed chip to chip and chip to carrier communications and methods of making such structures. The chip packaging structures do not require an interposer containing through silicon vias and/or provide structures having reduced warping.
Public/Granted literature
- US20170179047A1 PACKAGING FOR HIGH SPEED CHIP TO CHIP COMMUNICATION Public/Granted day:2017-06-22
Information query
IPC分类:
