Invention Grant
- Patent Title: Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier
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Application No.: US12195200Application Date: 2008-08-20
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Publication No.: US09953952B2Publication Date: 2018-04-24
- Inventor: Joachim Mahler , Michael Juerss , Stefan Landau
- Applicant: Joachim Mahler , Michael Juerss , Stefan Landau
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.
Public/Granted literature
- US20100044841A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-02-25
Information query
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