Invention Grant
- Patent Title: Effective device formation for advanced technology nodes with aggressive fin-pitch scaling
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Application No.: US15402770Application Date: 2017-01-10
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Publication No.: US09953976B2Publication Date: 2018-04-24
- Inventor: Injo Ok , Sanjay C. Mehta , Balasubramanian Pranatharthiharan , Soon-Cheon Seo , Charan V. Surisetty
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/00 ; H01L29/00 ; H01L27/088 ; H01L21/8234 ; H01L29/78 ; H01L29/66 ; H01L21/283 ; H01L21/311

Abstract:
After forming a gate stack straddling a portion of each semiconductor fin of a plurality of semiconductor fins located over a substrate, a gate liner is formed on sidewalls of a lower portion of the gate stack that contacts the plurality of semiconductor fins and a gate spacer having a width greater than a width of the gate liner is formed on sidewalls of an upper portion of the gate stack that is located above the plurality of semiconductor fins. The width of the gate spacer thus is not limited by the fin pitch, and can be optimized to improve the device performance.
Public/Granted literature
- US20170148789A1 EFFECTIVE DEVICE FORMATION FOR ADVANCED TECHNOLOGY NODES WITH AGGRESSIVE FIN-PITCH SCALING Public/Granted day:2017-05-25
Information query
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